Description: New Unicomp AX7100L X-ray inspection | imaging system is designed to provide high-resolution X-ray imaging for the electronics industry. The AX7100L series X-Ray Inspection System from Unicomp Technology is effective for many applications within the PCB assembly process. BGA, CSP, flip-chip, COB, QFN standard SMT and PTH attachment quality can be analyzed using the AX7100L. In addition to PCB inspection, the AX7100L can be utilized for many other electronics applications within a typical PCB assembly factory.
The AX7100L is excellent for: • Incoming inspection of semiconductors • Multi-layer PCB's quality monitoring • Encapsulated assemblies and components
Machine Benefits:
Performance/price
Variable magnification
Small footprint and mobile
Angle viewing
Ergonomic design
Powerful software workstation
Hi-tech appearance
Intuitive operator interface
Large sample area
SPC data collection
Large field of view (FOV)
Maintenance friendly-easy access
High resolution dual field detector
Plug and play set up
Configuration and Options: Image detector: High resolution Dual Mode Image Intensifier with FOV 2"-4", Detector Resolution 75/110 lp/cm, Magnification: 250X, Max PCB Size: 17"x15", Max Inspection Area: 16"x15", X-Ray Voltage: 100KV.
X-Ray Inspection
